Global 2.5D & 3D Semiconductor Packaging Professional Industry Research Report 2022-2028
- 189215
- 04-Feb
- Semiconductors
- 100
- Arsta Research
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Report Details
As the global economy recovers in 2021 and the supply of the industrial chain improves, the 2.The Global 2.5D & 3D Semiconductor Packaging Market is expected to register a CAGR of 16.2% during the forecast period (2022-2027). As 5G, AI, and high-performance computing continue to make inroads into the world, there's an escalating demand for semiconductor devices that deliver enhanced performance, lower latency, increased bandwidth, and power efficiency, achieved by 2.5D & 3D packaging technologies. In recent years, 2.5D & 3D has gained momentum as an ideal chipset integration platform due to their merits in attaining extremely high packaging density and energy efficiency. The global 2.5D & 3D Semiconductor Packaging industry report provides top-notch qualitative and quantitative information including: Market size (2017-2021 value and 2022 forecast). The report also contains descriptions of key players, including key financial indicators and market competitive pressure analysis. The report also assesses key opportunities in the market and outlines the factors that are and will drive the growth of the industry. Taking into account previous growth patterns, growth drivers, and current and future trends, we also forecast the overall growth of the global 2.5D & 3D Semiconductor Packaging market during the next few years. The global 2.5D & 3D Semiconductor Packaging market size will reach USD million in 2028, growing at a CAGR of % during the analysis period. Highlights-Regions The 2.5D & 3D Semiconductor Packaging market can be split based on product types, major applications, and important regions as follows: North America Europe Asia Pacific Latin America Player list ASE Group Taiwan Semiconductor Manufacturing Company Limited Amkor Technology Inc. Siliconware Precision Industries Co. Ltd (SPIL) Powertech Technology Inc. Types list 3D Wafer-Level Chip-Scale Packaging (WLCSP) 3D TSV 2.5D Application list Consumer Electronics Aerospace and Defense Medical Devices Communications and Telecom Automotive Others
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Table Of Content
Table of Content 1 Scope of the Report 1.1 Market Introduction 1.1 2.5D & 3D Semiconductor Packaging Introduction 1.2 Research Purposes 1.3 Report Timeline 2 2.5D & 3D Semiconductor Packaging Market Overview 2.1 World Market Overview 2.1.1 Global 2.5D & 3D Semiconductor Packaging Market Size & Forecast 2017-2028 2.1.2 2.5D & 3D Semiconductor Packaging Market Size CAGR by Region 2.2 2.5
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