COVID-19 Outbreak-Global Quad-Flat-No-Lead Packaging(QFN) Industry Market Report-Development Trends, Threats, Opportunities and Competitive Landscape in 2020
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- 24-Nov
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Report Details
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB.Flat no-lead packages include an exposed thermal pad to improve heat transfer out of the IC (into the PCB). Heat transfer can be further facilitated by metal vias in the thermal pad.The QFN package is similar to the quad-flat package (QFP), and a ball grid array (BGA). The Quad-Flat-No-Lead Packaging(QFN) market revenue was xx.xx Million USD in 2019, and will reach xx.xx Million USD in 2025, with a CAGR of x.x% during 2020-2025. Under COVID-19 outbreak globally, this report provides 360 degrees of analysis from supply chain, import and export control to regional government policy and future influence on the industry. Detailed analysis about market status (2015-2020), enterprise competition pattern, advantages and disadvantages of enterprise products, industry development trends (2020-2025), regional industrial layout characteristics and macroeconomic policies, industrial policy has also been included. From raw materials to end users of this industry are analyzed scientifically, the trends of product circulation and sales channel will be presented as well. Considering COVID-19, this report provides comprehensive and in-depth analysis on how the epidemic push this industry transformation and reform. In COVID-19 outbreak, Chapter 2.2 of this report provides an analysis of the impact of COVID-19 on the global economy and the Quad-Flat-No-Lead Packaging(QFN) industry. Chapter 3.7 covers the analysis of the impact of COVID-19 from the perspective of the industry chain. In addition, chapters 7-11 consider the impact of COVID-19 on the regional economy. The Quad-Flat-No-Lead Packaging(QFN) market can be split based on product types, major applications, and important countries as follows: Key players in the global Quad-Flat-No-Lead Packaging(QFN) market covered in Chapter 12: Linear Technology Corporation UTAC Group Amkor Technology ASE Industrial Holding, Co., Ltd. Texas Instruments STATS ChipPAC Pte. Ltd Microchip Technology Inc NXP Semiconductor Fujitsu Ltd In Chapter 4 and 14.1, on the basis of types, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 is primarily split into: Air-Cavity QFNs Plastic Molded QFNs In Chapter 5 and 14.2, on the basis of applications, the Quad-Flat-No-Lead Packaging(QFN) market from 2015 to 2025 covers: Portable Devices Radio Frequency (RF) Wearable Devices Others Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2015-2025) of the following regions are covered in Chapter 6, 7, 8, 9, 10, 11, 14: North America (Covered in Chapter 7 and 14) United States Canada Mexico Europe (Covered in Chapter 8 and 14) Germany UK France Italy Spain Russia Others Asia-Pacific (Covered in Chapter 9 and 14) China Japan South Korea Australia India Southeast Asia Others Middle East and Africa (Covered in Chapter 10 and 14) Saudi Arabia UAE Egypt Nigeria South Africa Others South America (Covered in Chapter 11 and 14) Brazil Argentina Columbia Chile Others Years considered for this report: Historical Years: 2015-2019 Base Year: 2019 Estimated Year: 2020 Forecast Period: 2020-2025
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Table Of Content
Table of Content 1 Quad-Flat-No-Lead Packaging(QFN) Introduction and Market Overview 1.1 Objectives of the Study 1.2 Overview of Quad-Flat-No-Lead Packaging(QFN) 1.3 Scope of The Study 1.3.1 Key Market Segments 1.3.2 Players Covered 1.3.3 COVID-19's impact on the Quad-Flat-No-Lead Packaging(QFN) industry 1.4 Methodology of The Study 1.5 Research Data Source 2 Executive Summary 2.1 M
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